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KIA3303C 30V 90A N 溝道 MOSFET|低 Rds (ON) 原裝現貨

信息來源:本站 日期:2026-04-29 

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KIA3303C 30V 90A N 溝道 MOSFET|低 Rds (ON) 原裝現貨

KIA 3303C 90A, 30V N-Channel MOSFET

KIA 3303C|30V/90A N 溝道 MOSFET,高效穩定之選

核心優勢:超低導通電阻(低至 2.6mΩ),大電流 90A承載,30V耐壓,低損耗、快開關、高可靠。
真實場景適配:
? 電源管理 / DC-DC:服務器、適配器、鋰電池 BMS,低發熱、高效率
? 負載開關 / PWM:電動工具、無人機、掃地機,浪涌穩、響應快
? 工業 / 消費電子:車載低壓、充電寶、筋膜槍,-55℃~150℃寬溫穩定
品質保障:100% 雪崩測試、增強 dv/dt 能力、低 Crss,DFN/TO-252 多封裝可選,適配高密度 PCB。
一句話價值:大電流不發燙,高頻開關不掉鏈,嚴苛工況更耐用,電源與驅動方案優選!

KIA3303C


一、國產替代(性價比首選)

AP90N03Q(銓力)

30V/90A,Rds(on)=3.6mΩ(@10V)

封裝:DFN3×3 / TO-252

場景:BMS、電動工具、負載開關

NCEP3090GU(新潔能)

30V/90A,Rds(on)=2.8mΩ(@10V)

封裝:DFN5×6 / TO-252

特點:低 Crss、快開關,兼容 KIA3303C 引腳

SM3303(矽微)

30V/90A,Rds(on)=2.6mΩ(@10V)

封裝:DFN3×3 / TO-252

對標 KIA3303C,參數幾乎一致,可直接替換

CRTD080N03L2P(華潤微)

30V/90A,Rds(on)=3.0mΩ(@10V)

封裝:TO-252 / DFN5×6

工業級,-55℃~150℃,適合電源管理

二、進口替代(高端 / 車規)

IPD90N03S4L-02(英飛凌)

30V/90A,Rds(on)=2.2mΩ(@10V)

封裝:TO-252(DPAK)

車規級,低損耗,適合高頻 DC-DC

STB200NF03(意法半導體)

30V/120A(冗余更大),Rds (on)=3.2mΩ

封裝:DFN5×6(PowerFLAT)

大電流冗余,適合電機驅動、快充

KIA3303C

三、參數對標總表(與 KIA3303C)

型號
Vds
Id
Rds(on)@10V
封裝
品牌
KIA3303C
30V
90A
2.6mΩ(DFN)/3.2mΩ(TO)
DFN3×3/5×6、TO-252
KIA
AP90N03Q
30V
90A
3.6mΩ
DFN3×3、TO-252
銓力
NCEP3090GU
30V
90A
2.8mΩ
DFN5×6、TO-252
新潔能
SM3303
30V
90A
2.6mΩ
DFN3×3、TO-252
新潔能
IPD90N03S4L-02
30V
90A
2.2mΩ
TO-252
英飛凌

四、推薦結論

優先國產替換:SM3303、NCEP3090GU,參數完全匹配,價格更低,交期穩。

車規 / 高端場景:IPD90N03S4L-02、STB200NF03,可靠性更高。

引腳兼容:以上型號均與 KIA3303C 引腳定義一致,直接替換無需改板




1. Features

  • RDS(ON)=2.6mΩ(typ.) @ VGS=10V, DFN3*3/5*6
  • RDS(ON)=3.2mΩ(typ.) @ VGS=10V, TO-252
  • Very Low On-resistance RDS(ON)
  • Low CRSS
  • Fast switching
  • 100% avalanche tested
  • Improved dv/dt capability

2. Application

  • PWM Application
  • Load Switch
  • Power Management

3. Pin Configuration

DFN3*3/5*6 Pin TO-252 Pin Function
4 1 Gate
5,6,7,8 2 Drain
1,2,3 3 Source

4. Ordering Information

Part Number Package Brand
KNG3303C DFN3*3 KIA
KNY3303C DFN5*6 KIA
KND3303C TO-252 KIA

5. Absolute Maximum Ratings (TC=25℃ unless otherwise noted)

Parameter Symbol DFN3*3/5*6 Rating TO-252 Rating Units
Drain-source voltage VDSS 30 30 V
Continuous drain current ID (TC=25℃) 90 90 A
ID (TC=100℃) 59 59 A
Pulsed drain current -Pulsed 1) IDM 400 400 A
Gate-source voltage VGS ±20 ±20 V
Single pulse avalanche energy 2) EAS 289 289 mJ
Power dissipation (TC=25℃) PD 66 70 W
Operating junction and storage temperature range TJ, TSTG -55 to 150 -55 to 150
Maximum lead temperature for soldering purposes, 1/8" from case for 5 seconds TL 300 300

*Drain current limited by maximum junction temperature.

6. Thermal Data

Parameter Symbol DFN3*3/5*6 Rating TO-252 Rating Unit
Thermal resistance junction-case RθJC 1.9 1.78 ℃/W

7. Electrical Characteristics (TC=25℃, unless otherwise noted)

Parameter Symbol Test Conditions Min Typ Max Units
Drain-source breakdown voltage BVDSS VGS=0V, ID=250uA 30 - - V
Drain-source leakage current IDSS VDS=30V, VGS=0V - - 1 uA
Gate-source forward leakage IGSS VGS=±20V, VDS=0V - - ±100 nA
Gate threshold voltage VGS(TH) VDS=VGS, ID=250uA 1.0 2.2 - V
Drain-source on-resistance RDS(on) VGS=10V, ID=20A (DFN3*3/5*6) - 2.6 3.9
VGS=10V, ID=20A (TO-252) - 3.2 4.0
VGS=4.5V, ID=15A (DFN3*3/5*6) - 3.9 5.6
VGS=4.5V, ID=15A (TO-252) - 4.5 5.6
Input capacitance Ciss VDS=15V, VGS=0V, f=1MHz - 3280 - pF
Output capacitance Coss - 360 - pF
Reverse transfer capacitance Crss - 320 - pF
Turn-on delay time td(on) VGS=10V, VDS=10V, RL=3Ω, ID=30A 3) - 10 - ns
Rise time tr - 100 - ns
Turn-off delay time td(off) - 54 - ns
Fall time tf - 98 - ns
Total gate charge(10V) Qg VDS=10V, ID=30A, VGS=10V 3) - 60 - nC
Gate-source charge Qgs - 28 - nC
Gate-drain charge Qgd - 3 - nC
Maximum Continuous Drain-Source Diode Forward Current IS - - 100 A
Maximum Pulsed Drain-Source Diode Forward Current ISM - - 400 A
Diode forward voltage VSD ISD=20A, VGS=0V, TJ=25℃ - - 1.2 V
Reverse recovery time Trr IF=20A, dl/dt=100A/μs - 20 - ns
Reverse recovery charge Qrr - 10 - nC

Notes:
1. Repetitive Rating: Pulse Width Limited by Maximum Junction Temperature.
2. EAS condition: TJ=25℃, VDD=15V, VG=10V, RG=25Ω, L=0.5mH.
3. Pulse Test: Pulse Width≤300us, Duty Cycles 0.5%

8. Typical Electrical Characteristics (Figures Summary)

  • Figure 1. On-Region Characteristics (VDS vs ID at different VGS)
  • Figure 2. Transfer Characteristics (VGS vs ID)
  • Figure 3. On-Resistance Variation vs Drain Current and Gate Voltage (RDS(on) vs ID at different VGS)
  • Figure 4. Body Diode Forward Voltage Variation with Source Current and Temperature (VF vs IF)
  • Figure 5. Capacitance Characteristics (Ciss, Coss, Crss vs VDS)
  • Figure 6. Gate Charge Characteristics (VGS vs Qg)
  • Figure 7. Vds Drain-Source Voltage vs Gate Voltage (VDS vs VGS)
  • Figure 8. On-Resistance vs Gate Voltage (RDS(on) vs VGS)
  • Figure 9. Maximum Safe Operating Area (ID vs VDS at different pulse widths)
  • Figure 10. Maximum Continuous Drain Current vs Temperature (ID vs TJ)
  • Figure 11. Transient Thermal Response Curve (Normalized Thermal Impedance vs Square Wave Pulse Duration)
  • Figure 12. On-Resistance Variation vs Drain Current and Gate Voltage (RDS(on) vs ID at different VGS)

KIA3303C

9. Test Circuits and Waveforms

  • Gate Charge Test Circuit & Waveform
  • Resistive Switching Test Circuit & Waveforms
  • Unclamped Inductive Switching Test Circuit & Waveforms
  • Peak Diode Recovery dv/dt Test Circuit & Waveforms


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KIA3303C

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